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A-DATA XPG DDR3-2000G unveiled

Posted on Monday, May 24 2010 @ 21:51:19 CEST by


A-DATA presents the XPG DDR3-2000G, a new 2000MHz memory module with 9-9-9-24 timings at 1.65V.
As the demand has increased for PC components for gaming market, including high speed and reliable DRAM module, A-DATA® Technology Co., Ltd., the worldwide leading manufacturer in high-performance DRAM modules and flash application products, today introduces its new XPG™ Gaming Series DDR3-2000G and XPG™ Gaming Series DDR3-2000G v2.0 DRAM module. Designed for favorite gaming and daily computing groups on Intel® X58, P55, and H55 platform, the new XPG™ Gaming Series DDR3-2000G DRAM module is promised to deliver CL9-9-9-24 timing with 1.65V voltage.

“A-DATA is the leader in the reliable and high performance DRAM module,” said Richard Shen, manager of A-DATA product management department. “Demand for fast speed combined with high stability DRAM module continues to increase and A-DATA is the leader in this field. Gaming enthusiast can relay on the new XPG Gaming Series DDR3-2000G DRAM module to achieve high speed and stability under the critical environment, while continue to enjoy the ultimate gaming experiences.”

Features and specifications of XPG Gaming Series DDR3-2000G DRAM Module

- All DRAM IC are verified by high standard criteria.
- High quality 8 layers PCB (Printed Circuit Board).
- Equipped aluminum heat spreaders to perform heat away from DRAM module.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime warranty.

Features and specifications of XPG Gaming Series DDR3-2000G v2.0 DRAM Module

- All DRAM IC are verified by high standard criteria.
- High quality 2oz copper 8 layers PCB (Printed Circuit Board):
- Assist spreading of heat from critical areas to perform effective thermal cooling.
- Decrease the resistance of electronic flow to avoid electric waste.
- Increase DRAM module’s lifetime.
- Improve signal integrity.
- Adopt aluminum heat spreaders with increased surface area to increase the efficiency of heat away.
- Thermal Conductive Technology (TCT) - Each memory chip is direct contact with the heat spreaders to perform immediate heat spreading from critical areas.
- Feature Extreme Memory Profiles.
- Backward compatible with DDR3-1600, DDR3-1333, and DDR3-1066.
- Packaging: 2GBx2 dual channel kit and 2GBx3 triple channel kit
- Optimized for 64-bit OS (operating system).
- Test at latency settings 9-9-9-24 at 1.55V-1.75V.
- SPD (Serial Presence Detect) programmed at JEDEC standard DDR3-1333 with latency settings at 9-9-9-24 for basic system booting.
- Limited lifetime warranty.



 



 

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