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UMC to sample 28nm 3D stacked chips in mid-2011

Posted on Wednesday, June 23 2010 @ 03:25:23 CEST by

DigiTimes writes UMC plans to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011:
United Microelectronics Corporation (UMC) expects to start sampling integrated 3D IC solutions using 28nm process technology in mid-2011, with volume production slated for 2012, according to company CEO Shih-Wei Sun. The foundry on June 21 announced plans to jointly develop 3D devices using through silicon via (TSV) technology with Elpida Memory and Powertech Technology (PTI).

The 3-way cooperation is aimed at leveraging the strengths of Elpida's DRAM, PTI's assembly and UMC's foundry logic technologies to develop 3D IC solutions that integrate logic and DRAM, according to their joint announcement.



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