Compared to gold-based bonding, copper-enabled wirebonding could reduce overall IC packaging costs by a whopping 20-to-30 percent, said Christian Rheault, senior vice president of marketing at wirebonding equipment giant Kulicke & Soffa Industries Inc. (K&S).
This, in turn, translates into a ''5 percent step reduction’’ in terms of the average price drop for a single chip, Rheault said.
The shift to copper bonding could also enable cheaper end-user products like cell phones, PCs and others, but it also has some chilling ramifications. The cheaper copper bonding process could take a bite out of margins and sales for the IC industry, meaning that the chip landscape is possibly due for another ''structural change,’’ he added.
Copper bonding to lead to cheaper chip prices
Posted on Sunday, September 12 2010 @ 11:00 CEST by Thomas De Maesschalck