The parts that will be made on the K0 silicon are Core i3 models 530 (new sSPEC: SLBX7), 540 (new sSPEC: SLBTD) and Core i5 models 650 (new sSPEC: SLBTJ), 660/661 (SLBTK/SLBTB), 670 (SLBTL). Newer and upcoming models such as the i3-550, i3-560, i5-665K, and i5-680 are already being built on the K0 stepping die. Motherboards will require a BIOS update to support the new K0 stepping processors.Source: TPU
The K0 stepping change includes the following highlights:
* New S-spec and MM numbers for the converting products
* Extended CPUID will change from 0x00020652 to 0x00020655
* Host RevID will change from 0x12 to 0x18
* K0 stepping package is pin compatible with C2 stepping package
* Adds Processor Context ID (PCID) support
Intel Core i3 and Core i5 dual-core chips get K0 stepping update
Posted on Monday, September 20 2010 @ 16:47 CEST by Thomas De Maesschalck