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TSMC ramps up production at its Chinese 200mm fabs

Posted on Monday, September 27 2010 @ 15:20:46 CEST by

TSMC announced its expanding monthly capacity at its Songjiang 200mm fab in Shanghai to 50,000 wafers by the end of 2010 compared to the current 45,000 units, with an upgrade to 60,000 units slated for 2011.
Tseng also pointed out that demand for advanced processing in China is growing. Citing subsidiary Global Unichip as an example, Tseng noted that the IC design service provider has already obtained orders for 40nm products from about 10 clients, one of which is a China-based chip designer. Tseng expects Global Unichip to land new orders for 40nm chip production from more China-based customers in 2011.

In addition, Tseng commented that 2010 will be a year of extraordinary growth for the semiconductor industry, and the business climate for the first quarter of 2011 may be slightly worse than that during the prior quarter. For all of 2011, Tseng said whether the sector can return to normal seasonality and growth still needs further observation.
Source: DigiTimes



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