Next-gen consoles to adopt tessellation

Knowing what manufacturing process should be available in 2012 you can expect 22nm chips in the best case scenario, chips that will get much more power efficient and way faster than what we have today. If you take in the account that the current high end core such as GF100 and soon to launch GF110 and Cayman have some 3+ billion transistors you can easily guess that the 22nm parts can theoretically pack almost four times as much. You will probably agree that twelve billion transistors sounds quite ridiculous.