"A dramatic shift in semiconductor manufacturing is now under way," Scalise said during testimony before the US-China Economic and Security Review Commission in Palo Alto, Calif. "Approximately two-thirds of the 300-mm wafer fabrication facilities now under construction worldwide are in Asia, with a significant portion of those facilities in China. Chinese government policies — not lower labor costs — are the principal factor in a differential of more than $1 billion in the 10-year cost of building and operating a 300-mm wafer fab in the U.S. versus China."Currently the U.S. semiconductor manufacturers hold 47 percent of the worldwide microchip market, but only 20 percent of the new state-of-the-art production facilities are built in the U.S. The rest is mainly build in Asia.
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