Posted on Monday, December 20 2010 @ 21:35 CET by Thomas De Maesschalck
Earlier this month
Intel revealed its new R&D wafer fab in Hillsboro, Oregon is being readied for 450mm and today TSMC
reveals it may make its yet-to-be-built Fab 16 compatible with 450mm production gear:
Taiwan Semiconductor Manufacturing Company (TSMC) has said it remains flexible on its yet-to-be-built "Fab 16" supporting equipment used to make chips on 18-inch wafers. The foundry also indicated that it would consider constructing later phases of expansion at Fab 15 compatible with production equipment for 18-inch wafers.
TSMC admitted its transition to the next wafer size will come behind schedule, as some of the tools needed are not yet ready, as well as the market's unreadiness.
