Intel has created an updated version of its boxed LGA775 HSF. The new cooler has a smaller base but according to Intel the cooling performance will not be affected. Chips with the new boxed cooler will start shipping on January 31st, 2011.
Seen below, the new heatsink seems to have a smaller base but Intel claims there won't be any performance differences due to the design change. Cooler mounting will also be unaffected.
Intel will begin shipping Pentium, Celeron, Core 2 Duo and Core 2 Quad chips bundled with the updated cooler on January 31st (2011). The old heatsink will continue to be available until inventory is depleted.