Intel rolls out updated LGA775 stock heatsink

Posted on Friday, December 31 2010 @ 13:14 CET by Thomas De Maesschalck

Intel has created an updated version of its boxed LGA775 HSF. The new cooler has a smaller base but according to Intel the cooling performance will not be affected. Chips with the new boxed cooler will start shipping on January 31st, 2011.

Seen below, the new heatsink seems to have a smaller base but Intel claims there won't be any performance differences due to the design change. Cooler mounting will also be unaffected.

Intel will begin shipping Pentium, Celeron, Core 2 Duo and Core 2 Quad chips bundled with the updated cooler on January 31st (2011). The old heatsink will continue to be available until inventory is depleted.

Source: TC Mag

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments

Share this story!