Researchers at the Georgia Tech Research Institute (GTRI) are developing a solid composite material to help cool small, powerful microelectronics used in defense systems. The material, composed of silver and diamond, promises an exceptional degree of thermal conductivity compared to materials currently used for this application.More info over here.
The research is focused on producing a silver-diamond thermal shim of unprecedented thinness – 250 microns or less. The ratio of silver to diamond in the material can be tailored to allow the shim to be bonded with low thermal-expansion stress to the high-power wide-bandgap semiconductors planned for next generation phased-array radars.
Silver-diamond compound to offer supreme cooling capabilities
Posted on Sunday, March 06 2011 @ 11:00 CET by Thomas De MaesschalckGeorgia Tech Research Institute scientists have created a silver-diamond composite thermal compound that could significantly enhance cooling capabilities for electronics. It's primarily intended for defense systems, but perhaps it will one day be sold for computer enthusiasts?
