VR Zone reports Intel will switch from TSOP to BGA packaging for its NAND flash memory because TSOP isn't advanced enough to handle the higher speeds requires by ONFI 3.0:
If you've ever seen a picture of an opened SSD or the inside of an SD card, you'll have noticed that the NAND Flash chips used are of the TSOP (Thin Small-Outline Package) variety, i.e. an oblong chip with small pins of the short ends. TSOP is a fairly standard packaging for a wide range of computer ICs, but it seems like more advanced technology will soon see it passed into the history books as far as NAND Flash is concerned.
According to Intel's NAND Flash roadmaps we're looking at a move towards BGA (Ball Grid Array) packaging as TSOP isn't advanced enough to handle the higher speeds required by new NAND Flash interfaces such as ONFI 3.0 (Open NAND Flash Interface). As such, all of Intel's enterprise level NAND Flash is already being transitioned to BGA packaging, both SLC and MLC products. For now the consumer (Intel refers to it as client) end of the market remains at TSOP as it's far cheaper to produce, but we'd expect things to look different come next year.