Posted on Tuesday, July 05 2011 @ 22:09 CEST by Thomas De Maesschalck
EE Times
reports TSMC may be the first to deliver semiconductors with 3D chips:
Chip foundry giant Taiwan Semiconductor Manufacturing Co. (TSMC) could deliver its first semiconductors with three-dimensional transistors by the end of 2011, potentially beating Intel Corp. to the punch in offering the first 3-D chips, according to a report circulated Tuesday (July 5) by a Taiwan trade group.
The report by the Taiwan External Trade Development Council (TAITRA) quoted an anonymous source saying that TSMC's projected delivery of 3-D chips matches that of Intel, the world's biggest chip maker. Intel announced with great fanfare in May that it would begin high-volume production of 3-D chips using tri-gate transistors by the end of the year.
