TSMC foresees 14nm on 450mm wafers by 2015

Posted on Thursday, September 08 2011 @ 23:12 CEST by Thomas De Maesschalck
TSMC R&D head Shang-yi Chiang said volume production of 14nm chips is expected to happen in 2015. Additionally, he also reveals this process node will use 450mm wafers.
Taiwan Semiconductor Manufacturing Company (TSMC) will conduct R&D for 14nm process technology starting 2012, and expects to begin volume production on the node in 2015, according to Shang-yi Chiang, company senior VP of R&D. TSMC will use 18-inch wafers to process 14nm chips, said Chiang, adding that manufacturing with larger wafers helps increase its ability to produce at a lower cost.

The transition to larger, 18-inch-sized wafers will also allow TSMC to build fewer fabs, meaning that labor and land costs can be reduced, Chiang pointed out. In its ongoing advanced technology development, TSMC is actually facing a shortage of engineers rather than technical issues, Chiang added.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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