Intel to reveal more about tri-gate and ultrabooks at IDF

Posted on Monday, September 12 2011 @ 21:20 CEST by Thomas De Maesschalck
EE Times writes Intel is expected to reveal more details about its 22nm tri-gate 3D transistor technology as well as ultrabooks at the IDF this week:
In May, Intel initially described its 22-nm process technology, with a surprise twist—the long awaited 3-D transistor design, dubbed tri-gate, that Intel has been developing since at least 2002. This week, Intel is expected to provide more detail about its first 22-nm chips, based on the Ivy Bridge architecture, expected to be in high-volume production by the end of the year.

According to Steven Smith, a vice president and director of netbook and tablet development and enabling at Intel, the firm will provide more technical details on the 22-nm the microarchitecture and process technology, as well as further discussion of the end-consumer benefits of the technology, which promises the potential to reduce power consumption by more than 50 percent compared to Intel's 32-nm processors. Intel will also talk about what it sees as its competitive advantages as an integrated device maker vis-à-vis fabless and fab-lite competitors, Smith said.
More details over here.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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