Intel and IBM's Common Platform technology alliance will invest $4.4 billion over five years in a R&D hub in New York to develop next-generation chip technology. The investment centers on two projects: Intel will focus on 450mm wafer technology while IBM, Samsung and GlobalFoundries will focus research on developing 22nm and 14nm chips.
The investment is centered around two projects, one led by IBM and its partners that will focus on building the next two generations of semiconductors, and another led by Intel that will focus on developing process technology for 450-mm wafers, dubbed the Global 450 Consortium, according to the statement issued by Cuomo's office.
Intel (Santa Clara, Calif.) is joined in the 450-mm development effort by IBM, Taiwan Semiconductor Manufacturing Co., Gloabalfoundries Inc. and Samsung Electronics Co. Ltd., according to the statement. Intel separately agreed to establish its 450-mm East Coast headquarters to support the overall project management in New York's capitol, Albany, according to the statement.