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IMEC foresees 450mm wafer availability in 2015

Posted on Wednesday, October 12 2011 @ 19:39:40 CEST by


EE Times reports IMEC presented its 450mm wafer fab roadmap:
European nanoelectronics research institute IMEC sees 2015 as about the time when the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available and hence as the time it will need to have a dedicated 450-mm wafer clean room available.

Luc van den Hove, president and CEO of IMEC laid out a timeline to a press gathering here. It began in 2012 with 450-mm wafer tool and metrology testing, moving on to 450-mm process development between about 2013 and 2016 and then into advanced production starting in about 2016.




 



 

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