IMEC foresees 450mm wafer availability in 2015

Posted on Wednesday, October 12 2011 @ 19:39 CEST by Thomas De Maesschalck
EE Times reports IMEC presented its 450mm wafer fab roadmap:
European nanoelectronics research institute IMEC sees 2015 as about the time when the first extreme ultra-violet lithography system able to run 450-mm diameter wafers will be available and hence as the time it will need to have a dedicated 450-mm wafer clean room available.

Luc van den Hove, president and CEO of IMEC laid out a timeline to a press gathering here. It began in 2012 with 450-mm wafer tool and metrology testing, moving on to 450-mm process development between about 2013 and 2016 and then into advanced production starting in about 2016.


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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