OCWorkBench heard third party processor cooler makers may not be able to release their products in time for the launch of Intel's Sandy Bridge E series. The site heard the delay is caused by design issues due to the large footprint of the LGA2011 socket:
As the new processors has a larger footprint and occupies almost 1/4 of the motherboard, heatsink manufacturers have to factor in design considerations to ensure that it doesn’t block the surrounding DIMM slots and other peripherals.
Although these heatsinks might be in shortage, the OEM heatsinks should be sufficient to handle the heat dissipation from the Sandy bridge operating at room temperatures.
We are also aware that some designs of motherboards might be able to adapt older generation of heatsinks, perhaps with 2 sets of mounting screws on the PCB.