TSMC reveals 20nm and 14nm plans

Posted on Wednesday, November 30 2011 @ 23:48 CET by Thomas De Maesschalck
TSCM spoke about its future plans at the TSMC 2011 Japan Technology Symposium and a press conference, you can read about it at Tech-On.
At the conference, Jack Sun, vice president and CTO, Research and Development of TSMC, explained about the status of the company's technology development. This time, he spent a relatively large amount of his time explaining about the company's packaging process (back-end process), on which it lays stress.

As for process development, while TSMC will keep the pace of advancing by one generation every two years, it is facing challenges such as the delay in throughput improvement of EUV (extreme ultra-violet) lithography and increasing lithography cost caused by the delay..


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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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