At the conference, Jack Sun, vice president and CTO, Research and Development of TSMC, explained about the status of the company's technology development. This time, he spent a relatively large amount of his time explaining about the company's packaging process (back-end process), on which it lays stress.
As for process development, while TSMC will keep the pace of advancing by one generation every two years, it is facing challenges such as the delay in throughput improvement of EUV (extreme ultra-violet) lithography and increasing lithography cost caused by the delay..
TSMC reveals 20nm and 14nm plans
Posted on Wednesday, November 30 2011 @ 23:48 CET by Thomas De Maesschalck