Posted on Thursday, December 08 2011 @ 21:36 CET by Thomas De Maesschalck
CENS
reports TSMC is making progress in its migration to sub-20nm process technology:
Taiwan Semiconductor Manufacturing Co. (TSMC) will synchronously construct the third and fourth production lines of its Fab 15 wafer fab and get them running in 2013, to pave the way for its migration to 20nm process technology.
The world’s No. 1 pure silicon foundry has recently started pilot production with the first production line of this cutting-edge 300mm wafer fab and will put it into general production after the upcoming Chinese New Year, which falls on January 23, 2012. The second line, still under construction, is set to start pilot production in the fourth quarter 2012. Both lines are set aside for making 28nm chips, with first line designed to have output of 50,000 wafers of chips or so a month in the initial stage.
