The report referenced TSMC as saying Tuesday (Dec. 12) that the earliest it would start building the fab would be 2015 to 2016 but that once the 450-mm diameter wafer size becomes mainstream it planned to also build 450-mm wafer fabs in Hsinchu and Tainan.
TSMC is expected to bring up 450-mm wafer processing at two of its established wafer fabs, built for 300-mm wafer processing, before building a dedicated 450-mm wafer fab.
TSMC 450mm fab projected to cost $26 billion
Posted on Wednesday, December 14 2011 @ 21:47 CET by Thomas De Maesschalck