Bit Tech reports about Invensas' multi face down (xFD) packaging technology for DRAM, a new technology that promises to deliver cheaper, faster and larger memory modules.
Invensas' xFD technology, which will form the heart of the presentation by the company's vice president and chief technologist Richard Crisp, promises much: using multi face down packaging, xFD DRAM modules feature a separated data line for each die in the package. The result, Invensas claims, is a multi-die package with single-die performance in an ultra-thin profile.
Using xFD, Invensas claims that memory makers can cram two DRAM dies into the same footprint of a single die thanks to a reduction in thickness of 30 per cent. The use of ultra-short separated interconnects, meanwhile, boosts performance to that of single-die packages. Finally, reduced material costs and a parallel process flow for manufacturing means that xFD modules are significantly cheaper than alternative multi-die packaging technologies.