Invensas' xFD technology, which will form the heart of the presentation by the company's vice president and chief technologist Richard Crisp, promises much: using multi face down packaging, xFD DRAM modules feature a separated data line for each die in the package. The result, Invensas claims, is a multi-die package with single-die performance in an ultra-thin profile.
Using xFD, Invensas claims that memory makers can cram two DRAM dies into the same footprint of a single die thanks to a reduction in thickness of 30 per cent. The use of ultra-short separated interconnects, meanwhile, boosts performance to that of single-die packages. Finally, reduced material costs and a parallel process flow for manufacturing means that xFD modules are significantly cheaper than alternative multi-die packaging technologies.
Invensas xFD DRAM promises lower cost, more performance, higher density
Posted on Wednesday, March 21 2012 @ 19:41 CET by Thomas De Maesschalck
Bit Tech reports about Invensas' multi face down (xFD) packaging technology for DRAM, a new technology that promises to deliver cheaper, faster and larger memory modules.