G.Skill debuts Trident X Series DDR3-2400MHz with modular heatsink

Posted on Thursday, April 19 2012 @ 21:14 CEST by Thomas De Maesschalck

G.Skill reveals Trident X DDR3 modules with a frequency of 2400MHz. These modules have a black PCB and feature a long black metal heatsink with a crown heatsink that can be detached if your processor cooler doesn't allow tall memory modules.

Aesthetically, the Trident X series modules don a black+red color scheme, which goes well with the black+red motherboard in the background (in the press-shot). Pictured below are the DDR3-2400 MHz (PC3-19200) modules in dual-channel configuration. The XMP profile runs the module at its 2400 MHz DDR (1200 MHz real) speed, with timings of 10-12-12-31T, and DRAM voltage of 1.65V. The modules will be available in various other speed/timing configurations, and in densities of 4 GB and 8 GB, making up for 8 GB and 16 GB dual-channel kits, for the new "Ivy Bridge" platform; 16 GB and 32 GB quad-channel kits for the Sandy Bridge-E platform. The older Sandy Bridge LGA1155 platform might not be 100% compatible, since it lacks XMP 1.3 support. G.Skill Trident X will be formally announced on May 4.

Source: TPU

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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