DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
December 17, 2017 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 58 people online.

 

Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
 

Follow us
RSS
 

High Ivy Bridge temperatures due to TIM inside heatspreader?

Posted on Thursday, April 26 2012 @ 21:49:39 CEST by


TechPowerUp reports overclockers discovered that there's thermal paste between the CPU die and the internal heat spreader (IHS) in Intel's Ivy Bridge processors. It's speculated that this may be part of the reason why Ivy Bridge runs hotter, as previous-generation processors used flux-less solder with a higher heat conductivity.
In comparison, Intel used flux-less solder to bind the IHS to the die on previous-generation Sandy Bridge Core processors in the LGA1155 package. Attempting to remove IHS off a chip with flux-less solder won't end well, as it could rip the die off the package. On the other hand, the idea behind use of flux-less solder in CPU packages is to improve heat transfer between the die and the IHS. Using thermal paste to do the job results in slightly inferior heat transfer, but removing IHS is safer. One can be sure that making it safe for IHS removal couldn't have been the issue behind switching back to conventional thermal paste, as everything under the IHS isn't user-serviceable anyway, and off limits for them.




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba