ARM, HP and SK Hynix join Hybrid Memory Cube Consortium

The Hybrid Memory Cube Consortium (HMCC) on Wednesday announced that new members ARM, Hewlett-Packard, and SK Hynix have joined the effort to accelerate widespread industry adoption of hybrid memory cube (HMC) technology. The new members will help to standardize HMC for different devices, from ultra-mobile products powered by ARM to mission-critical servers made by HP.

Micron and Samsung, the initial developing members of the HMCC, are working closely with Altera, IBM, Microsoft, Open-Silicon, Xilinx and now ARM, HP and SK Hynix - to draft an industry-wide specification that should pave the way for a wide range of electronic advances. With Micron, Samsung and SK Hynix aboard, it is safe to say that the key DRAM makers are now behind the HMC. With IBM and HP, it becomes apparent that high-end server system designers are also behind HMC. ARM is yet the only microprocessor technologies designer behind HMC, but keeping in mind that Intel was the first company to demonstrate the technology, it is likely that it will also support hybrid memory cube eventually.