Yesterday news hit the wire that Intel acquired a 15 percent stake in litography tool vendor ASML as part of a $4.1 billion deal to accelerate 450mm wafer and extreme ultraviolet (EUV) lithography technology, and today EE Times reports that ASML is also in talks with Samsung and TSMC over taking up to a 10 percent stake in the company under the same equity-plus-research deal.
The deals would be done under the same program that has seen Intel agree to take a 15 percent stake in AMSL (see Intel buys stake in ASML to boost 450-mm, EUV R&D). The three companies have been offered first refusal on the deal involving a 25 percent equity stake in ASML. "This is being done as a way to secure Moore's Law," said Eric Meurice, CEO of ASML, speaking on a conference call with analysts on Tuesday (July 10).
ASML announced Monday (July 9) that Intel would take a 15 percent stake in the company as part of a complex cash raising exercise to pay for continued research into technologies for extreme ultraviolet lithography and 450-mm diameter wafer production. Up to 25 percent of ASML is on offer so Intel's first move leaves Samsung and TSMC being asked to put up about $600 million in research funds and pay about $2 billion for a 10 percent stake in ASML.