Posted on Thursday, July 19 2012 @ 20:20 CEST by Thomas De Maesschalck
TechSpot
reports Sony has developed a prototype of a silicon and carbon-based thermal seet that promises to meet, if not exceed, the thermal conductivity of standard thermal grease.
Tech-On reports that a new product shown last week in Tokyo by Sony could solve these issues. The company revealed a prototype of a silicon and carbon-based thermal sheet currently known as "EX20000C" that measures 0.3-2.0mm thick with a thermal resistance of 0.4-0.2K cm2/W and a compressive load of about 1-3kgf/cm2 -- five or six times the effectiveness of Sony's previous solution.
EX20000C supposedly meets, if not exceeds the thermal conductivity of standard thermal grease. A show floor exhibit compared the sheet's effectiveness with a conventional setup and it managed to reduce the processor's temperatures by an additional three degrees Celsius. In addition to eliminating cleanup and preventing overapplication, the sheets last longer than paste because they don't degrade.
