DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
DarkVision Hardware - Daily tech news
March 24, 2018 
Main Menu
News archives

Who's Online
There are currently 78 people online.


Latest Reviews
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller

Follow us

Sony reveals silicon sheets that rival thermal paste

Posted on Thursday, July 19 2012 @ 20:20:25 CEST by

TechSpot reports Sony has developed a prototype of a silicon and carbon-based thermal seet that promises to meet, if not exceed, the thermal conductivity of standard thermal grease.
Tech-On reports that a new product shown last week in Tokyo by Sony could solve these issues. The company revealed a prototype of a silicon and carbon-based thermal sheet currently known as "EX20000C" that measures 0.3-2.0mm thick with a thermal resistance of 0.4-0.2K cm2/W and a compressive load of about 1-3kgf/cm2 -- five or six times the effectiveness of Sony's previous solution.

EX20000C supposedly meets, if not exceeds the thermal conductivity of standard thermal grease. A show floor exhibit compared the sheet's effectiveness with a conventional setup and it managed to reduce the processor's temperatures by an additional three degrees Celsius. In addition to eliminating cleanup and preventing overapplication, the sheets last longer than paste because they don't degrade.



DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2018 DM Media Group bvba