Intel reveals the SMARTi UE2p, a lower-cost 3G chip for smartphones. The chip integrates 3G power amplifiers into radio frequency circuits for a SoC solution, enabling a smaller footprint and reducing complexity. Samples will be provided to select customers beginning Q4 2012.
The SMARTi UE2p integrates Intel’s 3G high speed packet access (HSPA) radio frequency transceiver SMARTi UE2 and 3G power amplifiers on a single 65nm silicon die. The integration of power management and sensors allows direct connection to the device battery. The SMARTi UE2p supports multiple 3G dual band configurations for global operation with the Intel XMM62xx HSPA slim modem family.
"The SMARTi UE2p will simplify the product development and supply chain logistics with the reduction in component count and system complexity. This will allow our customers to introduce lower-cost 3G handsets and support the transition of the machine-to-machine market segment toward 3G-based connected devices to help enable the ‘Internet of things,” said Stefan Wolff, vice president of the Intel architecture group and general manager of Multi-Com.