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ASRock Z77 OC Formula uses GELID GC-Extreme thermal compound

Posted on Thursday, August 23 2012 @ 13:20:30 CEST by


GELID reports ASRock's new Z77 OC Formula overclocking motherboard comes with its GC-Extreme thermal compound.
Thermal Solutions specialist GELID Solutions has teamed up with ASRock™ to offer multi award-winning “GC-Extreme” thermal compound for ASRock’s™ first OC-oriented mainboard “Z77 OC Formula”.

Exclusively designed by the world's OC legacy performer, Nick Shih, this board aims at the enthusiast end of the market and is full to the brim with features. This celebrity board opens up overclocking possibilities and delivers control opportunities in every way, featuring the most detailed and considerate design of any overclocking motherboard.

In addition to that, the “GC-Extreme” makes the OC oriented mainboard even more attractive as the ultimate heat conductivity makes the “GC-Extreme” the leader of all thermal compounds. It doesn’t just help to break records but even makes overclocking with LN2 possible. “GC-Extreme” is non-electrical conductive, non-corrosive, no bleeding and non-curing. Created for the extreme users, the “GC-Extreme” thermal compound provides the best heat transfer from your CPU, VGA or even Chipset.

“Providing products with the best performance to professional users and partners is our target. In this case, we have achieved it”, says VC Tran, Marketing Director of GELID Solutions.




 



 

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