Evercool Venti HSF revealed

Posted on Tuesday, December 18 2012 @ 19:05 CET by Thomas De Maesschalck

Evercool introduces the Venti, a new processor cooler with a tower design. The heatsink features four 6mm direct-touch copper heatpipes and an aluminium fin array that is cooled by a 120mm EL bearing PWM fan that delivers 35.05-75.13CFM at a noise level of 22-38.1dBA. The cooler measures 125mm x 68mm x 160mm and weighs 588g.

Features:

PWM fan to adjust the power of the fan efficiently,enable HPQ-12025 to obtain both cooling performance and quietness.
Dual fan installed option provides increase the speed of heat conduction. (addition prices for dual fan purchase.)
H.D.T. (Heat-pipe direct touch) technology,efficiently diminish thermal resistance,enhancing heat conductivity.
4 x 6mm copper heat pipes soldered tightly with fin,to ensure fastest Thermal conductivity.
Up to 200W.
HPQ-12025 designed with all metal clips provides a secure attachment on motherboard for Intel socket LGA775, 1366, 1156, 1155, 2011/ AMD AM2, AM2+, AM3, FM1.

About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

Loading Comments

Share this story!