Posted on Friday, December 21 2012 @ 17:36 CET by Thomas De Maesschalck
Commenting on the rumors that Intel may move a larger number of its processors from LGA to BGA packaging, Asustek Computer vice president and general manager of motherboard/desktop business Joe Hsieh
told DigiTimes that the chip giant is likely to adopt a strategy to allow both methods to coexit:
Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of motherboard/desktop business Joe Hsieh has said that the issue will not be as bad as people think, and Intel is likely to adopt a strategy to allow the both methods to coexist.
Hsieh noted that even if Intel's ball grid array (BGA) packaging plans enter the desktop industry, the industry will continue to live on as motherboard makers will figure out how to handle and respond to the change.
