X-bit labs delivers news that Intel presented world's first fully patterned 450mm wafer at last week's SEMI Industry Strategy Symposium. No further details were shared by Intel at the event but previous reports indicate the chip giant plans to start manufacturing chips on 450mm wafers sometime from 2015 and onwards.
At the SEMI Industry Strategy Symposium (ISS) this week Intel demonstrated a 450mm wafer that is fully patterned for the first time. This wafer was created after intense collaboration which was necessary between Intel and various suppliers, three of whom are Sumco, Dainippon Printing and Molecular Imprints, according to Intel.
“It is an important step forward and it indicates that there will soon be substantial volume of patterned test wafers for use by suppliers in developing their 450mm tools,” explained Chuck Mulloy, a spokesman for Intel during a conversation with X-bit labs.