Xigmatek also announced Xi-3 HDT, a new thermal compound with a thermal conductivity of 9.1W/mK. This new thermal paste is specifically designed for heatsinks with direct-touch heatpipes, it promises not only to fill in the microscopic imperfections found on the heatsink surface but also the bigger gaps you would find on coolers with direct-touch heatpipes. The compound is sold in syringes of 4g and is not electrically conductive.
Xi-3 HDT Thermal Compound – Direct Performance Excelled Cooling, Direct Effect - HDT adaptable Compound Xi-3 HDT Thermal Compound is a viscous aqueous substance specifically designed to increase thermal conductivity for Heat-pipe Direct Touch Technology. The Xi-3 HDT is specially formulated to be electrically non-conductive and produces low thermal resistance. HDT-Heat-Pipe Direct Touch was one of Xigmatek’s remarkable inventions; our engineers re-invented the traditional heat-sink with the integration of the heat-pipes connecting the CPU. With such a great innovation many other coolers on the market now use our technology.
Xi-3 HDT is a newly re-designed Thermal Compound that is specially formulated and works not only by filling in the microscopic imperfections on the heat-sink surface, but it also can adapt and morph, filling in the bigger gaps you would find on HDT coolers eliminating the presence of air. This is perfect to use for CPU and GPU cooling. -Our Technology our Compound. Xi-3 HDT Thermal Compound – Excelled Cooling, Direct Effect Xi-3 HDT Thermal Compound is specifically designed to increase thermal conductivity for Heat-pipe Direct Touch Technology. We have re-formulated Xi-3 to efficiently fill in the microscopic imperfections on the heat-sink, especially the larger gaps on the HDT coolers. This is perfect to use for CPU and GPU cooling.