Mobile graphics core designer Imagination Technologies announced a collaboration with TSMC to optimize its graphics chips for the foundry's upcoming 16nm FinFET process technology:
Imagination Technologies, a leading designer of graphics processing technologies for mobile devices, and Taiwan Semiconductor Manufacturing Co., the world’s No. 1 contract maker of chips, on Monday announced the next phase of their technology collaboration. In a bid to enable its customers to use the latest process technologies, Imagination will create designs of its latest graphics cores compatible with TSMC’s 16nm FinFET tech.
Imagination will work closely with TSMC to develop highly optimised reference design flows and silicon implementations using Imagination’s PowerVR series-6 GPUs (in addition to previous-gen offerings as well as MIPS microprocessors) combined with TSMC’s advanced process technologies, including 16nm FinFET process technology. Imagination and TSMC R&D teams will also work together to create fully characterised reference system designs, utilizing high bandwidth memory standards and TSMC’s 3D IC technology capability to demonstrate new levels of system performance and capabilities while retaining all the essential characteristics of power, silicon area and small package footprint demanded by high volume mobile system-on-chips (SoCs).