Posted on Monday, April 08 2013 @ 13:08 CEST by Thomas De Maesschalck
X-bit Labs
reports leaked specifications of Intel's upcoming Core i 4000-series "Haswell" processors for embedded applications reveal that the chip giant is planning quite powerful chips for compact computing solutions:
Based on a picture that resembles slides from Intel’s roadmap, which was published by the Chinese version of VR-Zone web-site, Intel has added three central processing units based on Haswell architecture into the so-called R-series of chips in BGA packaging: Core i7-4770R, Core i5-4670R and Core i5-4570R. The microprocessors have four cores (the i7 version even has Hyper-Threading activated) and the most powerful version of integrated graphics adapter than Intel has to offer: HD Graphics 5200 (40 execution units with on-package cache memory). The chips have 65W thermal design power.
The new Core i “Haswell” R-series microprocessors in ball-grid array packaging will offer two times more powerful graphics core than that in standard land-grid away form-factor. Intel Core i-series “Haswell” chips in LGA packaging will only feature HD Graphics 4600, which has 20 execution units and no on-package cache; the HD Graphics 5200 has 40 execution units and on-package cache to improve speed of memory bandwidth hungry graphics effects, such as multi-sample antialiasing (MSAA).
