"If anybody pushes Moore's Law to extremes, TSMC will be there too, but that is not all we do," said Sun. "We also have specialized technologies such as embedded flash, high-voltage, power transistors, MEMS and image sensors -- a spectrum of technologies. And as we move monolithic CMOS on to more advanced nodes, all these other technologies can not be moved along with it -- that's where our interposers and 3-D technologies will enable system integration that allows them all to be used together in what we call a system super-chip packages."
TSMC discusses future fabbing technologies
Posted on Wednesday, May 15 2013 @ 14:51 CEST by Thomas De Maesschalck