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TSMC discusses future fabbing technologies

Posted on Wednesday, May 15 2013 @ 14:51:41 CEST by


TSMC logo
TSMC revealed details about its plans to dominate the system super-chip market to EE Times, you can read this interview over here.
"If anybody pushes Moore's Law to extremes, TSMC will be there too, but that is not all we do," said Sun. "We also have specialized technologies such as embedded flash, high-voltage, power transistors, MEMS and image sensors -- a spectrum of technologies. And as we move monolithic CMOS on to more advanced nodes, all these other technologies can not be moved along with it -- that's where our interposers and 3-D technologies will enable system integration that allows them all to be used together in what we call a system super-chip packages."




 



 

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