Intel CEO Brian Krzanich revealed earlier this week that despite an industry slowdown, the company will not reconsider the timing for 450mm manufacturing.
The transition to 450mm wafer manufacturing will be a very complex process that will take a long time to complete, and Intel strives to start switching to 450mm somewhere in "the second, latter half of this decade".
“We have not changed our timing [regarding 450mm]. We are still targeting the second, latter half of this decade. We continue to see great value in 450mm: it brings tremendous economic value to everybody who participates in it. We continue to work with our partners, we are here part of the joint development program in New York, continuing to work on 450mm. We continue to work with our partners, especially TSMC and Samsung and we are still targeting the back half of this decade [as time for commercial production]. This is a long ten-year program when you really take a look at it. So I think you will get mixed signals throughout those ten years,” said Brian Krzanich, chief executive officer of Intel.
This summer Intel confirmed the beginning of construction of the fab D1X module 2. The new facility will be the world’s first semiconductor manufacturing factory processing 450mm wafers, which will be used primarily for development purposes and which will lead the way for the whole multi-billion dollar industry.