DigiTimes heard rumors that Intel has placed orders to manufacture its upcoming SoFIA Atom processors at TSMC. Additionally, the site also claims that the chip giant has contracted GlobalFoundries and UMC for the production of entry-level baseband chips.
Intel's SoFIA SoCs designed for entry-level smartphones and tablets will be built using TSMC's 28nm HKMG process technology, said the sources. As for the other series of Atom SoCs codenamed Broxton, Intel will use its 14nm FinFET process to make the chips targeting high-end mobile devices.
Intel has also placed orders for entry-level baseband chips with Globalfoundries and UMC, using their respective 28nm PolySiON process nodes, the sources indicated. Initial shipments required by Intel are estimated at 7,000-8,000 wafers monthly.
