Intel's SoFIA SoCs designed for entry-level smartphones and tablets will be built using TSMC's 28nm HKMG process technology, said the sources. As for the other series of Atom SoCs codenamed Broxton, Intel will use its 14nm FinFET process to make the chips targeting high-end mobile devices.
Intel has also placed orders for entry-level baseband chips with Globalfoundries and UMC, using their respective 28nm PolySiON process nodes, the sources indicated. Initial shipments required by Intel are estimated at 7,000-8,000 wafers monthly.
Intel to make 28nm chips at TSMC/GlobalFoundries/UMC?
Posted on Friday, Jan 10 2014 @ 10:17 CET by Thomas De Maesschalck