
The 2GB DDR2-667 SODIMMs are manufactured using the Hynix 2Gb Dual Die Package (DDP) DDR2-667 components. The 2Gb DDP devices developed by Hynix Package Research Institute were also the first 2Gb devices to receive Intel validation and utilize two Hynix 1Gb DDR2-667MHz die into a single package.
The Hynix 2GB DDR2 SODIMMs running at 667MHz support future generations of Intel Centrino mobile platforms and increase overall memory performance by 25 percent while doubling memory capacity.