The 16nm FinFET+ process is expected to enter volume production in early 2015 and may help TSMC win A9 processor orders from Apple, the sources indicated.
Some mobile fabless customers may directly adopt the 16nm FinFET+ process since it gives an additional die shrink, while migrating from 20nm, according to JP Morgan Securities.
TSMC 16nm FinFET+ process to be ready for sampling by year-end
Posted on Monday, March 31 2014 @ 12:02 CEST by Thomas De Maesschalck