DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!
   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
DarkVision Hardware - Daily tech news
February 26, 2020 
Main Menu
News archives

Who's Online
There are currently 127 people online.


Latest Reviews
Ewin Racing Flash gaming chair
Arctic BioniX F120 and F140 fans
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset

Follow us

Toshiba and SanDisk to replace 2D NAND fab with 300mm 3D

Posted on Friday, May 23 2014 @ 11:08:58 CEST by

Toshiba logo
Toshiba announced it will raze its Fab 2 NAND memory production fab at Yokkaichi Operations, a NAND Flash memory plant in Mie prefecture, Japan to the ground to replace it with a more modern facility. Fab 2 started production in 2010, the fab produces 2D NAND flash memory at 200mm wafers. The new fab will be a joint-venture with SanDisk, it's projected to start churning out 3D NAND flash memory on 300mm wafers in 2016.
The Fab 2 building, which ended its 200 mm wafer production in 2010, is currently used as an office building, and after its demolition (due to start this month), construction of a new fab should begin in September 2014, with a target completion date of summer 2015.

Toshiba expects to begin mass production of 3D memory in the second Half of FY2015, relying on existing equipment from nearby Fab 3 and Fab 4. The company will then transition to Fab 2 to convert more 2D NAND capacity to 3D NAND as the clean room investments are finalized.
Source: EE Times



DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2019 DM Media Group bvba