Asetek receives patent for GPU waterblock

A thermal interposer for a heat-generating electronic component located on an adapter card of a computer includes a thermally conducting planar body. The thermally conducting planar body may be configured to be coupled to the adapter card such that a first surface of the planar body is in thermal contact with a surface of the electronic component. The thermal interposer may also include a cold plate assembly removably coupled to a second surface of the planar body opposite the first surface. The cold plate assembly may include an inlet adapted to receive a cooling liquid into the cold plate assembly and an outlet adapted to discharge the cooling liquid from the cold plate assembly.

Asetek®, the world’s leading supplier of computer liquid cooling solutions, today announced that the U.S. Patent and Trademark Office (USPTO) has allowed a patent on the company’s thermal interposer liquid cooling system designed for cooling graphic processing units (GPUs). Liquid cooling the GPU enables lower noise, lower temperatures, and enhanced performance over traditional air cooling.

“As seen in the recently announced AMD Radeon R9 295X2, the graphics cooling market is one that we see as having tremendous growth potential for our desktop business,” said André Sloth Eriksen, Founder and CEO of Asetek. “We continue to see increasing interest from GPU and graphics card manufacturers due to increased power use and demands for lower acoustics. Given this interest, it is possible that the GPU cooling business could rival our CPU cooling business in the coming years.”

Asetek has been developing liquid cooling solutions for graphics cards for more than 10 years using their patented sealed all-in-one liquid cooling technology. Factory filled and sealed for maximum reliability and ease-of-use, Asetek’s liquid coolers have been thoroughly tested and certified to operate without maintenance for over 50,000 hours.