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Intel switches back to soldered heatspreaders for Haswell-E

Posted on Tuesday, July 29 2014 @ 16:35:03 CEST by

Intel logo
Leaked shots of a delided Haswell-E processor reveal Intel may once again use soldered heatspreaders for its upcoming Haswell-E series. The company switched from soldered heatspreaders to thermal grease when it introduced its Ivy Bridge series but this move resulted in a poorer transfer of heat between the CPU die and the heatspreader.
Previously, Intel has soldered its heatspreaders directly to the die, creating a strong bond at the molecular level that ensures good heat transfer. In its Ivy Bridge family, it moved to using a thermal paste with an impact in heat transfer and a sudden resurgence of interest in de-lidding accessories. Although many considered the move to have been made out of a desire to boost profits, there were sound engineering reasons relating to smaller die sizes causing cracking of the solder and the formation of heat-trapping voids that can damage the chip.

Those issues appear to have been resolved in time for the Haswell-E enthusiast chip family, thankfully. An image published by OCDrift shows a de-lidded Core i7-5960X Haswell-E processor with half the die stuck to the heatspreader - suggesting that solder or an extremely strong thermal epoxy, rather than the weak-adhesive thermal paste of previous chips, has been used to join the two.
Intel Haswell-E soldered heatspreader

Source: Bit Tech



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