Intel switches back to soldered heatspreaders for Haswell-E

Posted on Tuesday, Jul 29 2014 @ 16:35 CEST by Thomas De Maesschalck
Intel logo
Leaked shots of a delided Haswell-E processor reveal Intel may once again use soldered heatspreaders for its upcoming Haswell-E series. The company switched from soldered heatspreaders to thermal grease when it introduced its Ivy Bridge series but this move resulted in a poorer transfer of heat between the CPU die and the heatspreader.
Previously, Intel has soldered its heatspreaders directly to the die, creating a strong bond at the molecular level that ensures good heat transfer. In its Ivy Bridge family, it moved to using a thermal paste with an impact in heat transfer and a sudden resurgence of interest in de-lidding accessories. Although many considered the move to have been made out of a desire to boost profits, there were sound engineering reasons relating to smaller die sizes causing cracking of the solder and the formation of heat-trapping voids that can damage the chip.

Those issues appear to have been resolved in time for the Haswell-E enthusiast chip family, thankfully. An image published by OCDrift shows a de-lidded Core i7-5960X Haswell-E processor with half the die stuck to the heatspreader - suggesting that solder or an extremely strong thermal epoxy, rather than the weak-adhesive thermal paste of previous chips, has been used to join the two.
Intel Haswell-E soldered heatspreader

Source: Bit Tech


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



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