Chip manufacturing tool maker ASML confirmed that companies will make 10nm chips mainly using traditional immersion lithography as extreme ultraviolet (EUV) continues to be delayed. The firm claims 10nm will be a squeezed node that no one will like but notes that there will be just enough cost reduction to let it go forward.
Most critical layers will require three or even four exposures, said ASML president and chief technology officer Martin Van den Brink in a 90-minute interview here.
“10 nm will be a squeezed node that no one will like, due to insufficient cost reduction, but there will be enough cost reduction to let it go forward,” Van den Brink said.
For the follow-on 7 nm generation, chipmakers will need to use EUV to make chips cost effectively, he insisted. Without it some layers would require as many as 13 passes through an immersion stepper, he told us.