ASML: 10nm to offer little cost reduction

Posted on Wednesday, September 17 2014 @ 11:51 CEST by Thomas De Maesschalck
Chip manufacturing tool maker ASML confirmed that companies will make 10nm chips mainly using traditional immersion lithography as extreme ultraviolet (EUV) continues to be delayed. The firm claims 10nm will be a squeezed node that no one will like but notes that there will be just enough cost reduction to let it go forward.
Most critical layers will require three or even four exposures, said ASML president and chief technology officer Martin Van den Brink in a 90-minute interview here.

“10 nm will be a squeezed node that no one will like, due to insufficient cost reduction, but there will be enough cost reduction to let it go forward,” Van den Brink said.

For the follow-on 7 nm generation, chipmakers will need to use EUV to make chips cost effectively, he insisted. Without it some layers would require as many as 13 passes through an immersion stepper, he told us.
Full details at EE Times.


About the Author

Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.



Loading Comments