Posted on Thursday, October 02 2014 @ 18:30 CEST by Thomas De Maesschalck
SK Hynix recently gave a presentation about High Bandwidth Memory (HBM), a new type of memory that using 3D stacking and promises revolutionary gains in capacity, bandwidth, power efficiency and a much smaller form factor.
SK Hynix is working together with AMD on this technology and it's believed that one of AMD's upcoming GPUs as well as an upcoming APU architecture will take advantage of HBM. With 128GB/s the first implementation of HBM promises over 4.5x the bandwidth of GDDR5 memory's 28GB/s and the second generation should double the bandwidth to 256GB/s. You can find the slide collection
at eTeknix.
There are no actual products mentioned, but they are working 21 designs that all are in progress. One of those products could very well be the upcoming Carrizo APU that is rumoured to have stacked on-package memory. Another AMD product where this would fit extremely well is the next generation of AMD GPU’s. Do I dare say Radeon R9 380X / 390X? This is pure speculation from my side, but the time-frame adds up and it would be a logic move. It also fits with the leaks and rumours we’ve seen so far. I’m sure this is just the beginning.
