
Posted on Monday, August 01 2005 @ 22:23 CEST by Thomas De Maesschalck
The Taiwan Economic News wrote Microsoft has contracted TSMC to make north bridge chipsets for the Xbox 360 console.
Under the deal TSMC will manufacture an expected volume of 6,000 300mm wafers a month, taking up almost 10 percent of TSMC's entire 300mm wafer fab capacity.
More details at
The Inquirer