The first slide shows off the new storage, wireless and I/O functionality, the Skylake platform will support eMMC 5.0, SDXC 3.0, PCIe 3.0, CSI2, USB OTG, SATA3, USB3/2, I2C, I2S, and UART. Wireless support includes 2x2ac + Bluetooth 4.1, Cat6 LTE, worldwide GNSS, Maple Peak WiGig, WiDi 6.0, and A4WP Wireless Charging.
Compared with Broadwell, the Skylake platform also gets some new media acceleration support, updated 2D camera, upgraded 3D camera, audio and speech updates and improved touch and sensing functionality.
In terms of performance, especially the low-power mobile chips are getting a big performance boost. The Y-series lineup for tablets and 2-in-1 convertibles reportedly offers up to 17 percent higher CPU performancen a huge 41 percent boost in integrated graphics performance and up to 1.4 hours longer battery life. The ultrabook-oriented U-series promises up to 10 percent more CPU power, a 34 percent integrated graphics boost and the same 1.4 hours increase in battery life.
Next is the H-series for regular and higher-end notebooks, this lineup promises up to 11 percent better CPU performance, up to 16 percent faster graphics and "up to 80 percent lower silicon power (CPU + PCH + WiFi + LAN)"
Intel's slide also mentions that the S-series for desktop PCs will deliver up to 11 percent higher CPU performance, up to 28 percent higher graphics performance and up to 22 percent lower TDP (from 84W to 65W).