AMD details its Carrizo APUs at Hot Chips 2015

Posted on Wednesday, Aug 26 2015 @ 16:08 CEST by Thomas De Maesschalck
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AMD shared a bunch of technical and architectural details about its 28nm Carrizo APUs at the Hot Chips 2015 conference, you can find a nice write-up with plenty of slides at WCCF Tech
The Carrizo AP features a nominal 5-15% IPC gains from the new Excavator cores which shows AMD is following Intel footsteps in this field with the blue team also offering a similar IPC improvement on their latest 14nm Broadwell Uarch while focusing on energy efficiency to make their designs more compatible with efficient PCs and low power solutions. AMD used the 28nm Bulk High Density node to build Carrizo and has managed to optimize the overall chip design by adding 29% more transistors than Kaveri making it more denser, thanks to the high-density design library. This results in a 3.1 Billion transistor die that delivers 40% lesser power consumption and 23% lesser die area than its predecessor.
AMD Carrizo Hot Chips conference

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Thomas De Maesschalck

Thomas has been messing with computer since early childhood and firmly believes the Internet is the best thing since sliced bread. Enjoys playing with new tech, is fascinated by science, and passionate about financial markets. When not behind a computer, he can be found with running shoes on or lifting heavy weights in the weight room.

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