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GlobalFoundries: 14nm LPP tapeout is a success

Posted on Monday, September 28 2015 @ 11:24:11 CEST by

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GlobalFoundries announced the first chips made using its second-generation 14nm process technology, the 14nm LPP (low-power-plus) node, have been successfully taped out. No specifics about clients were shared, but Jason Gorss, senior manager of corporate and technology communications at GlobalFoundries, went on record that "prototyping on test vehicles has demonstrated excellent logic and SRAM yields and performance at near 100% of target."

The 14LPP process is largely similar to 14nm LPE but should allow the creation of complex SoCs that run at up to 10 percent higher frequencies and feature lower power consumption. Gorss added that the performance-enhanced version of 14LPP is set for qualification in the second half of 2015, with volume ramp beginning in early 2016. The tape-out of products to be made on 14LPP reportedly started "a while ago".
Earlier this year Advanced Micro Devices confirmed that it had taped-out its first two products to be made using FinFET manufacturing technologies. According to unofficial information, AMD will use GlobalFoundries’ 14LPP fabrication process to produce its code-named “Summit Ridge” central processing unit with up to eight “Zen” cores, which will be marketed under “FX” and “Opteron” brands late next year. AMD is expected to use Taiwan Semiconductor Manufacturing Co.’s 16nm FinFET+ (CLN16FF+) for production of its the code-named “Greenland” graphics processing unit based on the next iteration of the GCN [graphics core next] architecture.
Source: KitGuru



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