Earlier in 2015, TSMC disclosed plans to roll out another 16nm FinFET process developed specifically for mid-to-low-end mobile devices, wearables and IoT applications. The version, called 16FFC, has been introduced to its clients in the fourth quarter of 2015.
TSMC president and co-CEO CC Wei suggested previously that the 16FFC process will be ready for volume production in the second half of 2016. Wei also estimated that TSMC's 16nm FinFET technology will receive a total of about 50 product tape-outs covering different chip products. Total production capacity of TSMC's 16nm FinFET processes at the end of 2016 will triple that a year earlier, Wei noted.
TSMC rolls out cheaper, low-power 16FFC process
Posted on Thursday, Oct 15 2015 @ 13:39 CEST by Thomas De Maesschalck