DV Hardware - bringing you the hottest news about processors, graphics cards, Intel, AMD, NVIDIA, hardware and technology!

   Home | News submit | News Archives | Reviews | Articles | Howto's | Advertise
 
DarkVision Hardware - Daily tech news
October 18, 2017 
Main Menu
Home
Info
News archives
Articles
Howto
Reviews
 

Who's Online
There are currently 136 people online.

 

Latest Reviews
Jaybird Freedom 2 wireless sport headphones
Ewin Racing Champion gaming chair
Zowie P-TF Rough mousepad
Zowie FK mouse
BitFenix Ronin case
Ozone Rage ST headset
Lamptron FC-10 SE fan controller
ZOWIE G-TF Rough mousepad
 

Follow us
RSS
 

Chinese foundries adopting FD-SOI to compete with FinFET

Posted on Friday, October 30 2015 @ 13:33:18 CET by


DigiTimes reports the Chinese chip wafer foundry firms in China are focusing on Fully Depleted Silicon-on-Insulator (FD-SOI) as a competitor to the FinFET technology adopted by TSMC and Intel. The site says this process technology will primarily be used for smaller chip orders for low to medium-priced chips, the other end of the spectrum (high-priced, high-performance, high-volume) will more likely be produced at FinFET fabs.
FD-SOI is characterized by lower forward voltage and operating voltage requirements and also more power saving. Meanwhile, the operating cost of FD-SOI per circuit is lower than that of FinFET.

However, the FD-SOI process has not been scaling down as well as FinFET, and the transistor density of FD-SOI is also lower than that of FinFET, Digitimes Research noted.

Current advocates for the FD-SOI process include Globalfoundries, Samsung Semiconductor and STMicroelectronics. China-based HH Grace Semiconductor is also expected to join the FD-SOI camp.




 



 

DV Hardware - Privacy statement
All logos and trademarks are property of their respective owner.
The comments are property of their posters, all the rest © 2002-2017 DM Media Group bvba